
Technology media Tom's Hardware reported on the 15th day, China or using patent application to integrate four AI ASIC Shengteng 910Bs to form Shengteng 910D. The patent involves advanced packaging, with the aim of allowing the bare crystals stacked parallel above the intermediary layer to connect and display the design scheme of four bare crystals. This article will show you the following: SMIC has limited breakthrough in advanced processing, integrating four Shengten 910B mass production and cost-effectiveness to follow the mainstream AI chips of international factories. Multi-chip integration solutions may be difficult to supplement performance gaps.